Innovative Solutions for your Design Challenges

Central Semiconductor is dedicated to solving our customers’ most relevant design challenges with innovative and responsive solutions. From a package or dimension change to a parametric electrical screening to a semi-custom new design, Central is here to assist with a host of products and services to meet these challenges head on.

Success: #145

Challenge

OEM required a bypass diode in die form with the anode and cathode on the same plane. This die also required a cathode band marker on the die itself. Since a pick and place assemble would be utilized the die needed to be on tape and reel.

Solution

Central’s product design team developed a lateral die using a via technology placing anode and cathode connections on the same side of the die. The wafer was scribed with a cathode band to ensure orientation was correct. The die was delivered on tape and reel.

Success: #182

Challenge

OEM was experiencing extreme failure rates due to issues caused by a highly moisture sensitive environment. Rework expenses were affecting the bottom line and brand reputation.

Solution

Central’s product design team developed a solution removing all Silver from the effected component, changing the internal die attach and modifying wire bond materials. The end result is that Central delivered a failure free solution in an extremely short completion time.

Success: #192

Challenge

OEM was experiencing failures in their underwater communications devices. A solution was required to avert high rework costs. The extreme environment would required re-imagining the construction of the device to meet the very stringent requirements detailed by the customer.

Solution

Central’s product design team developed a solution to ruggedize the failing component to ensure zero defects. This required a redesign of the device construction and packaging. In addition an extensive testing plan was implemented to prove the effectiveness of the design. To date, and with several years of use, zero defects reported.