Process Change Notices

This section lists all process change notices for all Central Semiconductor devices. All files are Portable Document Format files (PDFs) on this page. View files using the Adobe Acrobat Reader.

PCN #

Description

101	Dimension change to all Bridge Rectifiers in SMDIP  package

102	Dimension change to all Bridge Rectifiers in DIP  package

103	TO-92 -18R lead formed package
104	SOD-80 cylindrical case replaced by flat SOD-123 case.
105	Small signal wafer thickness reduced from 9.0 mils to 7.1 mils.
106	5.0W Zener diodes packaged in the AX-5W case replaced by devices packaged in the DO-201 case.
107	An overall reduction of the die area. The CP192V chip process currently measures 13 x 17 mils and is being replaced by the CP392V chip process which measures 11 x 11 mils. The CP592V chip process currently measures 12 x 20 mils and is being replaced by the CP792V chip process which measures 11 x 11 mils.
108	An overall reduction of the die area. The CPZ19 chip process currently measures 17.7 x 17.7 mils and is being replaced by the CPZ28 chip process which measures 13 x 13 mils.